Introducing AMD Instinct™ MI100 Accelerator
First Data Center GPU to Surpass 10TF FP64 Barrier
Accelerate Your Discoveries
AMD Instinct™ MI100 accelerator is the world’s fastest HPC GPU, engineered from the ground up for the new era of computing. Powered by the AMD CDNA architecture, the MI100 accelerators deliver a giant leap in compute and interconnect performance, offering a nearly 3.5x the boost for HPC (FP32 matrix) and a nearly 7x boost for AI (FP16) throughput compared to prior generation AMD accelerators.
MI100 accelerators supported by AMDROCm™, the industry’s first open software platform, offer customers an open platform that helps eliminate vendor lock-in, enabling developers to enhance existing GPU codes to run everywhere. Combined with the award winning AMD EPYC™ processors and AMD Infinity Fabric™ technology, MI100-powered systems provide scientists and researchers platforms that propel discoveries today and prepare them for exascale tomorrow.
Designed on AMD CDNA Architecture with 120 Compute Units (7,680 cores)
World’s Fastest HPC GPU with up to 11.5 TFLOPs Peak FP64 Performance
Up to 46.1 TFLOPs FP32 Matrix Peak Performance with All-New Matrix Cores for HPC & AI Workloads
Up to 184.6 TFLOPs FP16 & 92.3 TFLOPs bFloat16 Peak for Ultra-Fast AI Training
32 GB Ultra-fast HBM2 ECC Memory with upto 1.2 TB/s Memory Bandwidth
Open & Portable AMD ROCm™ Ecosystem
2nd Gen Infinity Architecture with up to 340 GB/s of aggregate P2P GPU I/O bandwidth
PCIe® Gen 4 x16 Ready GPU
World’s Fastest HPC GPU
Delivering up to 11.5 TFLOPs of double precision (FP64) theoretical peak performance, the AMD Instinct™ MI100 accelerator delivers leadership performance for HPC applications and a substantial up-lift in performance over previous gen AMD accelerators. The MI100 delivers up to a 74% generational double precision performance boost for HPC applications.
- Built-in 32 GB memory to hold textures, frame buffer, shadow maps, bump maps, and lightning info that allows the GPU to perform rapid rendering
- Power-efficient passive cooling to dissipate heat that enables enduring usability